OptoTEC™ MBX Series for Compact, High-Performance Optoelectronic Cooling
Laird Thermal Systems has unveiled the OptoTEC™ MBX Series, a line of micro thermoelectric coolers designed for advanced, space-constrained optoelectronic applications. Leveraging innovative thermoelectric materials and automated manufacturing processes, the MBX Series is engineered to deliver exceptional cooling performance in compact form factors ideal for high-performance devices. This new series supports seamless integration into packages such as TO-Can, TOSA, and Butterfly, with the smallest model measuring just 1.5 x 1.1 mm and as thin as 0.65 mm, making it an efficient solution for applications where space is at a premium.
The MBX Series achieves high heat-pumping densities up to 43 W/cm², with temperature differentials reaching 82°C at ambient temperatures up to 50ºC. This high cooling capacity and precise temperature stabilization protect critical optoelectronic components operating in high-temperature environments, such as laser diodes, optical transceivers, LiDAR, IR sensors, and Indium Phosphide (InP) VCSELs. The MBX Series’ efficient thermal management ensures that these components maintain stable performance, reduce crosstalk, and extend operational lifespans in demanding applications.
“Advancements in the optical communications industry, driven by applications like AI and machine learning, require robust temperature stabilization for laser diodes in high-speed optical transceivers,” said Andrew Dereka, Thermoelectrics Product Director at Laird Thermal Systems. “The MBX Series provides reliable cooling solutions that enable optoelectronic devices to operate with consistent wavelength stability and reduced interference. Our investment in a high-precision automation production line highlights our commitment to delivering reliable, high-volume capacity.”
The MBX Series has passed Telcordia GR-468 CORE qualification testing, ensuring it meets rigorous standards for reliability and durability, even in challenging environments. The product line is customizable, allowing for unique configurations of form factors, heat-pumping densities, and power efficiencies tailored to specific applications. With solder construction supporting reflow temperatures up to 280ºC and options for wire-bondable attachments, the MBX Series is well-suited to a variety of optoelectronic needs. Additional finishing options, including Au-plated patterns, thermistor attachments, and hermetic sealing, make this series compatible with both hermetic and non-hermetic packaging.
For more information, visit Laird Thermal Systems’ website.
