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ProGlove was selected among hundreds of candidates as one of the World Economic Forum’s ‘Technology Pioneers’.

Anritsu has announced its enhanced partnership with Bluetest AB of Sweden offering a new unified test solution for Over The Air (OTA) measurement of 5G mobile terminals.

GaN Systems is proudly sponsoring the distinguished China Power Supply Society (CPSS) design competition, which focuses on innovation in energy conservation, emission reduction, and new energy utilization.

Synopsys has announced the latest release of its LucidShape CAA V5 Based software product to provide complete design and visualization workflow solution for automotive lighting design within the CATIA V5 environment.

Vision AI software company Neurala announced its VIA (Vision Inspection Automation) software: an integrated solution to help manufacturers improve quality inspection on the production line while scaling to meet product demands.

Altium is partnering with IHS Markit Electronic Parts Solutions to solve one of the major challenges in PCB design.

When it comes to rust preventative packaging for metal parts, most VCI (vapor corrosion inhibitor) moisture barrier papers are waxed or coated with polyethylene (PE).

Picture a flexible circuit board (FPCB) and you will almost inevitably visualise a sheet of orange/brown plastic, probably with a few copper traces and maybe some soldered components on it.

5G is considered as one of the largest market opportunities in the coming years, with large scale roll-out of infrastructures and rapid adoption of 5G devices and services.

Driven by camera phones and the rapid spread of new embedded applications, CMOS image sensors were the fastest growing semiconductor product category in the last decade with sales quadrupling between 2010 and 2019 to reach $18.4 billion…

The new 130 page IDTechEx report, ‘Electronics Reshaped 2020-2040’, reveals how electrically smart, multifunctional materials are enabling the added-value materials industry to bypass the traditional electronic and electrical business.

The Intent-based Networking Market is set to grow from its current market value of more than $900 million to over $4.5bn by 2026; as reported in the latest study by Global Market Insights.

Nexperia has announced a new range of GaN FET devices featuring next-gen high-voltage GaN HEMT H2 technology in both TO-247 and the company’s proprietary CCPAK surface mount packaging.

Renesas Electronics has introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator.

Altium has helped make the transition seamless, empowering collaboration across every aspect of the design process.