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TAG Heuer, Google and Intel Announce Swiss Smartwatch Collaboration
Baselworld, Switzerland, 19 March 2015 — TAG Heuer, Google and Intel have announced a partnership to launch a Swiss…
Bourns’ Breadth of Semi-Shielded Power Inductors Provides Comprehensive…
Bourns, Inc., a leading manufacturer and supplier of electronic components, today introduced an additional…
Introducing the new TI SensorTag
The new TI SensorTag is based on the CC2650 ultra-low power wireless MCU, offering a ®-M3 and a fraction of the…
Power Integrations’ New Charger Design for Smart Mobile Devices Showcases High…
SAN JOSE, Calif.--(BUSINESS WIRE)-- Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated…
New Vishay Intertechnology 20 V Chipscale MOSFET Saves Space, Extends Battery…
Vishay Intertechnology, Inc. introduced a new TrenchFET® 20 V n-channel MOSFET designed to save space, decrease…
Molex Expands Heavy Duty Connector Portfolio for Industrial Automation
Molex Incorporated announces the expansion of its Heavy Duty Connectors following the recent acquisition of the…
Microchip Introduces 3V 16-Mbit, 32-Mbit and 64-Mbit Serial Quad I/O™ Interface…
CHANDLER, Ariz., — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and…
Two engineering alumni redesign devices that power computers, cellphones
Many students dream of bridging the gap between academic achievement and entrepreneurial impact. Two recent…
Texas Instruments introduces 32-bit MSP432™ microcontrollers (MCUs):…
DALLAS, -- Texas Instruments (TI) (NASDAQ: TXN) today announced its MSP432™ microcontroller (MCU) platform, the…
Blog by Grant Imahara debuts on Mouser’s Popular Bench Talk for Engineers…
Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic…