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Designing materials for future fusion reactors
Researchers at the Department of Energy’s SLAC National Accelerator Laboratory have recorded the most detailed…
Getting the measure of etching – why you shouldn’t default to stamping
When manufacturing components from metals there are numerous options available to design engineers, some…
What do industrial engineers need to know about functional safety?
Sensata Technologies has announced the availability of a new white paper about Functional Safety practices…
3D Greenpeace Amazon Reef survey completed
UK subsea services company, Rovco has announced the successful completion of an underwater survey of the Amazon…
Flow synthesis of novel nanomaterials for next-gen electronic devices
Uniqsis has reported how the Institute of Physics at the University of Tartu (Estonia) has used a FlowSyn…
PCB fuse holders manufactured from flame-retardant Polyamide
New rectangular semi-enclosed PCB fuse holders are now available from Hylec-APL, the specialist supplier of…
Toshiba develops 4.5kV press-pack IEGT with improved rupture resistance
Toshiba Electronics Europe will be providing details on its new packaging for its 4.5kV class press-pack IEGT (PPI)…
How robots and digitization will change the way we work
With around 1.8 million industrial robots, the number of robots has reached a new record in factories around the…
The future of Industrial IoT implementations in factory automation
eeDesignIt sat down with Miro Adzan, General Manager, Factory Automation and Control after the keynotes to discuss…
Next-gen THERMOCOMP HMD-D compounds at NPE 2018
SABIC introduces new THERMOCOMP HMD-D series of high modulus ductile compounds to the Americas, Europe at NPE 2018.