Browsing Category
Design
Innovative tool enables precise selection of the right O-ring material
The Engineered Materials Group of Parker Hannifin has announced the availability of a new web-based engineering…
Industry’s first 16-port 50GbE Ethernet Physical Layer (PHY) transceiver
Marvell has announced the launch of the 88X7120, the latest offering in its Alaska C family of high-speed Ethernet…
DSM optimized software implementation integrated into smartphone SoC
CEVA has announced the availability of Dynamic Speaker Management (DSM) software from Maxim Integrated Products.
SmartEdge Platform gives access to custom single-chip solutions
S3 Semiconductors has announced the introduction of its SmartEdge Platform, giving its customers access to…
IoT Development Kit (IDK) expands key vertical IoT applications
Significant expansion of sensor and software capabilities expands key vertical IoT applications addressed by the…
S3 Semiconductors joins Arm Approved design partner program
S3 Semiconductors is pleased to announce that they have joined the Arm Approved design partner program.
KONNEKT technology enables higher power densities
New patented KONNEKT technology enables high power density by combining multiple components into a single surface…
Smart camera kit for vision systems at the edge of the IIoT
congatec has introduced its first MIPI CSI 2 Smart Camera Kit for vision systems at the edge of the IIoT.
HDD series 2TB model delivers more capacity for storage applications
The new MQ04 HDD series 2TB model delivers more capacity for notebook PCs, game systems and other client storage…
Chip-to-cloud IoT connectivity strengthened with enterprise cloud toolbox
Enterprise cloud toolbox quickly connects users applications to enterprise cloud vendors, enables wireless…