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Embedded
MCUs offer signal-chain elements for sensing applications
Texas Instruments has announced the addition of MCUs with integrated signal-chain elements and an extended…
High-speed MCUs with multiple packages and memory sizes
Toshiba has announced the launch of the second M3H group in the TXZ family of low-power, high-speed…
96-layer BiCS FLASH development with QLC technology
Toshiba Memory Europe has announced that it has developed a prototype sample of a 96-layer BiCS FLASH, memory…
Industry’s first SSD using 96-layer 3D flash memory
Toshiba Electronics Europe has introduced a new lineup of solid state drives (SSDs) that are based on its 96-layer,…
Innovative EDSFF data storage solutions at Flash Memory Summit
Reference design solutions for emerging enterprise data center SSD form factor (EDSFF) implementations have been…
2018 update of Embedded C Coding Standard released
The embedded systems experts, Barr Group, today released an update of the influential Embedded C Coding Standard.…
Product capabilities expanded with LynxSecure Separation Kernel Hypervisor
Supplier of processor solutions for demanding environments, Concurrent Technologies, has partnered with Lynx…
Spin-orbit torque MRAM devices fabricated on 300mm Si wafers
At this week’s 2018 Symposia on VLSI Technology and Circuits, imec will demonstrate for the first time the…
JPR Electronics stocks LattePanda Windows 10 single board computer
Specialist distributor JPR Electronics can now supply the LattePanda Windows 10 single board computer from stock.
Artosyn license and deploy CEVA-XM4 intelligent vision platform
CEVA has announced that Artosyn Microelectronics has licensed and deployed the CEVA-XM4 intelligent vision platform…