FRAMOS Sensor Tech Days 2018 presents the latest innovations

The third FRAMOS Sensor Tech Days conference, held from May 15 to 16 in Hamburg, Germany, will offer the ideal platform for vision system developers to share information and exchange ideas. This workshop will feature exclusive presentations by SONY Japan, ON Semiconductor, INTEL and XILINX on current vision developments, new products and technologies and future trends and innovations. The conference will focus on Embedded Vision, Industrial Automation and a broad variety of lead-edge applications, as well as talks on effective equipping, suitable lens solutions and 3D imaging.

Day one, SONY Japan will show insights about new CMOS leading technologies, an overview on its sensor roadmap and present its new on-chip polarization technology with live demonstration. XILINX speaks on how innovation in FPGA’s is enabling the next-gen vision systems. Based on the leading-edge SLVS-EC interface, FRAMOS will introduce the in house-developed SLVS-EC IP Core for Xilinx FPGA blocks, promising shorter development cycles and accelerated design time.

Sensor Development specialist, First Sensor, will be discussing packaging technology for bare die sensors. The FRAMOS’ lens and sensor experts will explain how to come from a system MTF chart to a sensor MTF chart, and will talk about the technical lens innovations set to determine the quality of vision systems in the future. The first day will be closed with networking and discussion opportunities on a dinner event.

Best practices and networking as factors for success

“The aspects I liked most were pretty much that the event addresses leading-edge technologies and you have the opportunity to talk directly to company representatives from the major players, like SONY Japan. The technology roadmap updates, technical details and overall demonstrations gave super helpful insights on a deep level for vision system engineers and developers, together with the networking with the suppliers and peers,” according to an attendee from the FRAMOS Sensor Tech Days 2017.

Day two, Intel will outline how perception and 3D vision can be an advantage in vision, using new Intel robust computer vision technologies for depth sensing in multiple formats. They will take the audience on a walk thru RealSense functionality principles, building scalable elements, usage scenarios and solutions. ON Semiconductor will present the company’s current product range and roadmap supporting the variety of future vision applications by advanced technologies like EMCCD, and depth technology. They will introduce a new versatile family of Global Shutter CMOS image sensors for the first time at the FRAMOS Sensor Tech Days 2018.

Leading lens company Fujinon will give an introduction on its new anti-shock and vibration technology for consistent image quality in robotics and in high-vibration industrial environments. Customized sensor specialist Pyxalis will talk about fully customized and semi-customized sensor solution to meet the requirements of modern vision applications creating uniqueness and outstanding performance. During both conference days, there will be many opportunities for participants to network with fellow attendees and specialists.