High-Efficiency 150 V TrenchFET® Gen V Power MOSFET for Telecom and Industrial Applications

Vishay Intertechnology has introduced the SiRS5700DP, a next-generation 150 V TrenchFET® Gen V n-channel power MOSFET designed to deliver higher efficiency and power density for applications in telecom, industrial, and computing sectors. Housed in the compact PowerPAK® SO-8S (QFN 6×5) package, this advanced device offers significant improvements over previous-generation PowerPAK SO-8 models.

Key Performance Highlights

The SiRS5700DP dramatically reduces power losses and enhances performance metrics, making it an ideal solution for demanding power conversion applications. Highlights include:

• Industry-Leading Efficiency: The device achieves an ultra-low on-resistance of 5.6 mΩ at 10 V, minimizing conduction losses.
• Enhanced Power Density: With an RthJC (thermal resistance junction-to-case) of just 0.45 °C/W, the MOSFET supports continuous drain currents up to 144 A, enabling compact, high-power designs.
• Improved Figure of Merit (FOM): The on-resistance times gate charge FOM is reduced by 15.4%, optimizing performance for power conversion systems.
• Robust Design: The device provides a 62.5% lower RthJC and a 179% increase in continuous drain current compared to its predecessors.

These advancements are critical for next-generation power supply systems, such as 6 kW AI server power systems, where efficiency and thermal performance are paramount.

Ideal Applications

The SiRS5700DP is tailored for a wide range of applications, including:

• Telecom Power Supplies: Synchronous rectification and DC/DC conversion.
• Industrial Systems: Motor drives, power tools, and solar inverters.
• Computing and Data Storage: Edge computing, servers, supercomputers, and data centers.
• Battery Management Systems: Hot swap switching and OR-ing functionality.

RoHS-compliant and halogen-free, the device is also 100% Rg and UIS tested, ensuring reliability in harsh environments. It meets IPC-9701 criteria for temperature cycling, further bolstering its suitability for demanding applications.

Compact Design for Easy Integration

The SiRS5700DP’s 6 mm x 5 mm footprint is fully compatible with the standard PowerPAK SO-8 package, simplifying design integration for engineers.

Availability

Samples and production quantities of the SiRS5700DP are available now. For lead time information, customers can contact their local Vishay sales office. For more information about Vishay and its products, visit www.Vishay.com