Indium Features InFORMS Reinforced Solder Preforms At APEC 2017

By Editorial Team Last updated Sep 7, 2017

Indium will feature its reinforced solder alloy fabrications, InFORMS, at APEC 2017, March 26^th-30^th, in Tampa, Fla.

InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.

In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:

Four improved thermal cycling reliability compared to a solder preform-only approach
Two improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
Low-voiding of <1%
Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment

Visit Indium at booth #525.