MB Allen to present research at the SMTA Space Coast Expo
Plans to exhibit at the SMTA Space Coast Expo and Tech Forum, scheduled to take place Thursday, November 17th, 2016 at the Melbourne Auditorium in FL have been announced by KIC. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding” at 11am.
Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.
Additionally, KIC will highlight its smart oven technologies that automatically measure the PCB profile and its match to the relevant process window. Share this continuous and near real time process and traceability data with all authorized personnel and MES over the factory’s LAN. True process data helps the maintenance people troubleshoot and fix issues faster.
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