eeDesignIt - Engineering 101

Analog Devices, has announced that it has been ranked #17 in the Corporate Knights 2019 list of the 100 Most Sustainable Corporations in the World. This is the third consecutive year that ADI has risen on the list, having ranked #42 in 2018…

A company specializing in metallic retro modeling with mechanical engines, Time for Machine, has added six exquisite new metallic self-assembling sets to its exclusive collection of old-timers.

It has been announced that the Synopsys Design Platform has been certified for TSMC's latest System-on-Integrated-Chips (TSMC-SoIC) 3D chip stacking technology. The platform-wide enablement, combined with a highly flexible reference flow,…

Fire in any kind of confined space or controlled atmosphere is even more terrifying than it is in the wild. Fires in space are particularly tough to tackle for two reasons: fire behaves differently in space and most of the fires that occur…

AVX Corporation has released the first wire-to-board RF coaxial IDC connectors for industrial and automotive applications. The initial release of the new 00-6791 Series RF Coaxial IDC Connectors is comprised of two small, single-piece…

Heart disease is the leading cause of death in the U.S. Given that heart transplantation is currently the only treatment available for end-stage heart disease patients, the need for advances in cardiac regenerative medicine is urgent.…

A new type of origami can morph from one pattern into a different one, or even a hybrid of two patterns, instantly altering many of its structural characteristics. Origami-based structures have been used to create deployable solar arrays…

Seamlessly incorporating more conductive inks that use nanoparticle silver, graphene and gallium into manufacturing processes has been a two-step approach for the last decade. Used to make the radio frequency identification tags used in…

It has been announced by Cadence Design Systems that TSMC certified Cadence’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC) 3D advanced chip stacking technology, which integrates heterogenous chips, including…

Artificial lift technology company, Upwing Energy, will unveil new downhole technologies at its first Offshore Technology Conference (OTC) appearance in Houston from May 6th to May 9th. Upwing will showcase its Subsurface Compressor System…