eeDesignIt - Engineering 101

Extending the benefits of WiFi 6 to the broader smartphone market where high performance and total solution cost are equally important design considerations, Broadcom announced the BCM43752 chip. The BCM43752 is a highly integrated chip…

Between 1% and 5% of children in the U.S. and western European companies could have Fetal Alcohol Spectrum Disorder (FASD), according to some studies. A new tool developed by scientists at the University of Southern California (USC),…

Shape memory polymers (SMP) have major implications for healthcare, and Syracuse University engineers have created a new kind of SMP that could be useful for healing. SMPs are soft, rubbery, "smart" materials that can change shape in…

At Mobile World Congress (MWC) 2019, Intel announced the Intel FPGA Programmable Acceleration Card N3000 (Intel FPGA PAC N3000), designed for service providers to enable 5G next-generation core and virtualized radio access network…

GaN Systems has made strides in the past few years. Especially as Gallium Nitride (GaN) reaches prime time status. This year, the impact of GaN will become evident in the presentations, displays, and demonstrations to be presented by GaN…

ITG Electronics now offers a range of Nanocrystalline Common Mode Chokes; DCN Series, C20530 Series, C20540 Series, C30530 Series and C30540 Series of Common Mode Chokes,  which deliver higher power ratings in a small size.…

There will be plenty of new launches coming out of this year's Applied Power Electronics Conference (APEC). Let's take a look at this one from ITG Electronics. ITG Electronics now offers a range of common footprints as well as custom…

Software and hardware security is an ongoing game of cat and mouse: As security technologies improve, hackers eventually find ways around these barriers. Hardware security is further complicated as the Internet of Things continues to…

The IC industry has been on a mission to pare down older capacity (≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. In its recently released Global Wafer Capacity 2019-2023 report, IC Insights shows that…

Specialist in standards compliance, LDRA, automated software verification, software code analysis, and test tools, has welcomed the arrival of MISRA C:2012 (3rd Edition, 1st Revision), and the announcement that two world-leading consortia…