eeDesignIt

Software modules with enhanced imaging technology

Editorial Team Dec 12, 2018 0

New software modules with enhanced imaging technology has been introduced by ZEISS. The ZEISS ZEN Connect is useful for structural analysis, examination of cellular processes, and localization of cells. The ZEISS ZEN software combines…

Wireless

Solutions for battery-free IoT devices

Editorial Team Dec 12, 2018 0

Licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, CEVA, has announced that Atmosic Technologies (Atmosic), an innovator of ultra-low-power wireless for the Internet of Things…

Design

Mineralogic v1.6 offers a range of capabilities

Editorial Team Dec 12, 2018 0

The release of the ZEISS Mineralogic software at the Process Mineralogy '18 conference in Cape Town, South Africa. This is the 7th instalment of ZEISS Mineralogic since the software was brought to the market in July 2014 and represents a…

Optoelectronics

Greater precision while scanning without limits

Editorial Team Dec 11, 2018 0

OEM laser deflection and positioning systems manufacturer SCANLAB has added even more materials-processing power control capabilities to XL SCAN, the combined solution for simultaneously controlling scan heads and XY stages. For specialized…

Trends

Marvell wins GSA public semiconductor company award

Editorial Team Dec 11, 2018 0

Awarded based on feedback from the greater GSA community, Marvell has been named the ‘2018 Most Respected Public Semiconductor Company’ by the Global Semiconductor Alliance, for companies with $1bn to $5bn in annual sales. The award…

Trends

Electrical industry urged to ensure compliance with wiring regulations

Editorial Team Dec 11, 2018 0

All electrical contractors must ensure they are up to date with the new requirements for BS 7671:2018, when the 18th Edition of the IET Wiring Regulations comes into effect on 1st January 2018. From the New Year all new electrical…

Design

Innovation pressure vs in-circuit test

Editorial Team Dec 11, 2018 0

If a product is improved or obsolete components have to be replaced, these changes will affect every process in electronics manufacturing. From solder paste printing to assembly, inspection, and testing, none of these steps will remain…

Passives

Stacked nanowire gate-all-around transistors for N3 and beyond

Editorial Team Dec 11, 2018 0

At this week’s 2018 IEEE International Electron Devices Meeting (IEDM), imec, the research and innovation hub in nano-electronics and digital technology, reported significant progress in process enabling the introduction of gate-all-around…

Wireless

Low-cost USB dongle aids wireless designs

Editorial Team Dec 11, 2018 0

The nRF52840 dongle has been designed by Nordic Semiconductor as an ideal front-end, physical gateway for the nRF Connect for Desktop PC tool. It allows developers to immediately connect a PC to a wireless device. This further simplifies…

Passives

Stack FinFETS with 45nm fin pitch using sequential 3D integration

Editorial Team Dec 11, 2018 0

At the IEEE IEDM 2018 conference, imec, the research and innovation hub in nanoelectronics and digital technologies, presented a demonstration of 3D stacked FinFETs on 300mm wafers using a sequential integration approach with a 45nm fin…