Small and secure RF modules for embedded applications
Solid State Supplies now offers the XBee3 embedded RF modules from Digi. The modules ease the design task with easy-to-add functionality and flexible wireless connectivity.
New Drone Standards in 2018 set to revolutionise UK and global economies
New Drone Standards are to be unveiled for the first time in Spring 2018 which are expected to lead to strengthened public confidence.
Imec and Cadence design the industry’s first 3nm test chip tapeout
Extreme ultraviolet and 193 immersion lithography technology and Cadence digital tools used to design 3nm CPU core.
The 2nd International VDI Conference ‘Smart Farming’
The 2nd International VDI Conference 'Smart Farming' will give an insight into the latest trends and developments in Duesseldorf on April 10 and 11.
Precision Micro to return to Medtec Europe
Precision Micro is reinforcing its market-leading status in chemical etching, as well as showing its absolute commitment to the demands of its medical customers, in the area of titanium etching.
Binder ELC series 570 prevents mismating with intuitive locking system
The binder ELC series 570 has an intuitive locking system to ensure positive mating with miss-mating being prevented.
emCompress-ToGo added to emCompress compression software family
SEGGER has announced emCompress-ToGo, a new member of the emCompress compression software family.
Microsemi expand growing SiC discretes and modules portfolio
New devices ideally suited for power applications in rugged environments to be showcased in booth 1147 at APEC Exhibition March 4-8.
Noise-immune capacitive-sensing MCUs bring touch control
MSP430 microcontrollers with CapTIvate technology offer value and performance to applications exposed to electromagnetic disturbances, oil, water and grease.
An important step-change in the way complex equipment is designed
AutomationML represents an important step-change in the way complex equipment is designed, installed and maintained.