Partner Awards bestowed at the Open Innovation Platform Forum Event

Four ‘2018 Partner of the Year’ awards have been bestowed by TSMC upon Synopsys for Interface IP and joint development of five nanometer (nm) design infrastructure and Virtual Design Environment (VDE) Cloud Solution, plus joint delivery of the Wafer-on-Wafer (WoW) Design Solution.

Synopsys and TSMC have collaborated for more than 18 years, most recently to accelerate the adoption of FinFET technology for optimum power, performance, and area for the five nanometer process. This is the eighth consecutive year Synopsys has received both IP and electronic design automation (EDA) accolades from TSMC.

Dr Michael Jackson, corporate vice President of Synopsys’ Design Group, stated: “We are honored to receive these prestigious awards from TSMC. Through this kind of deep engineering collaboration with TSMC on its 5-nanometer processes, WoW Design Solution, VDE Cloud Solution, and interface IP, we have enabled a state-of-the-art design platform and IP portfolio in a proven path that designers can take to accelerate their time-to-market goals.”

Suk Lee, senior director of TSMC’s Design Infrastructure Marketing Division, added: “We have presented the 2018 Partner of the Year award to Synopsys in recognition of our collaboration to deliver important innovations in the field of semiconductor design. With its extensive high-quality DesignWare IP portfolio, certified Design Platform, and Cloud Solution, Synopsys and TSMC are addressing our customers’ needs to achieve their design goals and accelerate production.”