TDK – InvenSense to present a ‘World of Sensors’ at CES 2018
TDK – InvenSense will be at this year’s 2018 Consumer Electronics Show in Las Vegas, Nevada, January 9-12. In 2017, InvenSense became part of the Sensor Systems Business Company of TDK. InvenSense with its parent company, TDK will be located in South Hall 3, of the Las Vegas Convention Center, booth #30325. This year it will be showcasing its ‘World of Sensors’ MEMS sensor platforms and services.
TDK brings together TDK, EPCOS, InvenSense and Micronas branded sensors in a comprehensive portfolio of sensor solutions and will showcase extensive sensors offerings at CES 2018. Sensors will be showcased in real-world applications such as AR/VR headsets, automobiles, drones, and wearables.
TDK’s expanding sensor portfolio covers sensing temperatures, pressures, currents, and magnetic fields, as well as positions, angles, and acceleration rates. The sensor offerings complement TDK’s existing roster of electronic components, modules, and systems (capacitors, inductors, ferrites, and RF products); power supplies; magnetic application products, and flash memory application devices.
Product highlights include:
InvenSense Pressure Sensors:
The new InvenSense ICP-101XX barometric pressure sensor family is based on MEMS capacitive technology which provides ultra-low noise at the lowest power, enabling industry leading relative accuracy, sensor throughput, and temperature stability. It detects <5cm vertical movement and consumes only 1.3uA, enabling new use cases such as improved drone hovering, activity and air-flow monitoring, and always-on motion sensing. The ICP-101XX measures pressure differences with an accuracy of +/-1Pa, enabling vertical motion measurement differentials of less than a single stair step. Also on display is the InvenSense ICM-20789, the industry’s first 7-axis motion and pressure sensor (3-axis Accel, 3-axis gyro and pressure), for consumer electronic, drone and IoT markets.
TDK TMR Angle Sensor:
The TAD2141 sensor achieves the industry’s highest accuracy of angle error of ±0.05° with guaranteed accuracy of angle error of ±0.2 over its lifetime. This contributes significantly to miniaturization and weight savings, compared to the angle detection method of conventional resolvers. For the first time in North America, the TAD2141 will be demonstrated in a robotic arm, showing its effectiveness in industrial applications.
EPCOS Automotive Sensors: High-performance and long-term stable pressure sensing elements are designed for pressure ranges of 100mbar up to 40 bar. The dies are available with sizes of 0.69×0.69mm up to 2x2mm. The automotive market benefits from dies with optional gold bond pads for high temperatures up to 170°C and high corrosion resistance or high burst pressures.
InvenSense Motion and Microphones: InvenSense’s robust portfolio of MEMS 3/6/7/9 axis motion sensors are accompanied by the highest performing MEMS audio microphones. CES attendees can see a demonstration of the new ICM-40688, InvenSense’s next-generation MEMS 6-axis integrated inertial device that combines a 3-axis gyroscope and a 3-axis accelerometer. The ICM-40688 significantly outperforms other motion sensors with extended motion range, superior noise performance and temperature stability of accelerator and gyroscope.
Micronas Hall-Effect Sensors: Hall sensors enable sensing in both dynamic and static magnetic fields, making them ideal for determining speed, positions and angles in automotive applications. TDK-Micronas has already delivered more than four billion Hall sensors to the automotive and industrial markets.
As the demand for sensor technologies grows across industries, TDK offers sensors, sensor solutions, and platforms for mobile, wearable, AR/VR, automotive, Internet of Things (IoT), drone, and industrial applications. TDK’s strategy is to market the entire TDK sensor portfolio to its customers. For this reason, products from, InvenSense, TDK USA, EPCOS Inc, and TDK-Micronas are each represented on the TDK booth.
