The dashboard lit up again—an issue with the blind-spot sensor. That was the third time this quarter. Nathan, a senior design engineer at a major Tier 1 supplier, stared at the validation report, knowing exactly what it meant: another round of testing, another delay, and more cost.
Designing sensor…
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Danisense Unveils Advanced TEDS Functionality to Enhance Lab Accuracy and Efficiency
Last week, at APEC 2025 in Atlanta, GA, Danisense introduced a new Transducer Electronic Datasheet (TEDS) functionality designed to simplify lab setups and elevate measurement accuracy for test engineers. This latest development reflects…
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7 Things We Know About Power Electronics After APEC 2025
The Applied Power Electronics Conference (APEC) 2025 has come to a close, and if one thing is clear, it's that power electronics is evolving at an astonishing rate. From cutting-edge semiconductor breakthroughs to an industry-wide push for…
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How NeoMesh is Enabling Scalable, Self-Healing IoT Connectivity
As the Internet of Things (IoT) continues to expand into diverse industries, the need for reliable, energy-efficient, and adaptable wireless networking solutions is becoming increasingly urgent. Traditional wireless technologies often face…
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Advancing Power Supply Efficiency: The Next Step for TinySwitch Technology
Power supply efficiency continues to be a key concern for designers across various industries, from consumer electronics to industrial and medical applications. Addressing the demand for compact, high-efficiency solutions, Power…
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Can China’s RISC-V Revolution Reshape the Global Chip Industry?
For decades, China’s semiconductor industry relied heavily on well-established foreign architectures, primarily x86 and ARM, which have dominated computing worldwide. The x86 architecture, owned by Intel and AMD, powers nearly all of the…
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How Remote SIM Provisioning is Transforming IoT Connectivity
The rapid expansion of IoT (Internet of Things) networks is driving demand for more flexible, scalable, and cost-effective connectivity solutions. Traditionally, deploying IoT devices has required physical SIM cards, which can be cumbersome…
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Next-Gen Modular Test Platform with Enhanced Performance and Industrial Adaptability
The demand for flexible, software-defined instrumentation is growing across industrial, scientific, and research applications. In response, Red Pitaya has launched the STEMlab 125-14 Gen 2, an upgraded version of its widely adopted test and…
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Why HPC Chip Designers Are Turning to Linear Pluggable Optics
The rapid evolution of high-performance computing (HPC) and hyperscale data centers has pushed interconnect technologies to their limits. As AI-driven workloads, large-scale machine learning models, and GPU-accelerated computing demand…
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Cambridge GaN Devices Unveils High-Power GaN Technology for EV Inverters
The electric vehicle (EV) market is on the cusp of a major shift as Cambridge GaN Devices (CGD) introduces a new 100kW+ Combo ICeGaN® technology—a solution designed to improve inverter efficiency while cutting costs. By combining ICeGaN…
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A Budget-Friendly Debugger for Engineers and Hobbyists
Debugging and programming microcontrollers can be an expensive hurdle, especially for students, hobbyists, and smaller engineering teams working on a budget. Microchip Technology aims to change that with the release of the MPLAB PICkit…
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